Features & Benefits
1.High area productivity with total mounting lines
Higher productivity and quality with printing, placement and inspection process integration
2.For larger boards and larger components
PCBs up to a size of 750 × 550 mm with component range up to 150 × 25 mm
3.Higher area productivity through dual lane placement (Selection spec.)
Depending on the PCB you produce, you can select an optimal placement mode – “Independent” “Alternate” or “Hybrid”
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Panasonic NPM-W
Features & Benefits
1.High area productivity with total mounting lines
Higher productivity and quality with printing, placement and inspection process integration
2.For larger boards and larger components
PCBs up to a size of 750 × 550 mm with component range up to 150 × 25 mm
3.Higher area productivity through dual lane placement (Selection spec.)
Depending on the PCB you produce, you can select an optimal placement mode – “Independent” “Alternate” or “Hybrid”
| Placement Head |
16 nozzle head |
|---|
Description
SPECIFICATION
| Model ID | NPM-W | |||||||
| Rear head Front head |
16-nozzle head | 12-nozzle head | 8-nozzle head | 3-nozzle head | Dispensing head | No head | ||
| 16-nozzle head | NM-EJM2D | NM-EJM2D-MD | NM-EJM2D | |||||
| 12-nozzle head | ||||||||
| 8-nozzle head | ||||||||
| 3-nozzle head | ||||||||
| Dispensing head | NM-EJM2D-MD | - | NM-EJM2D-D | |||||
| Inspection head | NM-EJM2D-MA | NM-EJM2D-A | ||||||
| No head | NM-EJM2D | NM-EJM2D-D | - | |||||
| PCB dimensions (mm) | Single-lane mode*1 | Batch mounting | L 50 x W50 ~ L 750 x W 550 | |||||
| 2-positin mounting | L 50 x W50 ~ L 350 x W 550 | |||||||
| Dual-lane mode*1 | Single transfer | L 50 x W50 ~ L 750 x W 510 | ||||||
| Dual transfer | L 50 x W50 ~ L 750 x W 260 | |||||||
| PCB exchange time | Single-lane mode*1 | Batch mounting | 4.4s ( With no component mounted on the reverse side of PCB ) | |||||
| 2-positin mounting | 2.3s ( With no component mounted on the reverse side of PCB ) | |||||||
| Dual-lane mode*1 | Single transfer | 4.4s ( With no component mounted on the reverse side of PCB ) | ||||||
| Dual transfer | 0s *No 0s when cycle time is 4.4 s or less | |||||||
| Electric source | 3-phase AC 200, 220, 380, 400, 420, 480 V 2.5 kVA | |||||||
| Pneumatic source *2 | 0.5 MPa, 200 L /min (A.N.R.) | |||||||
| Dimensions *2 (mm) | W 1 280*3 × D 2 332 *4 × H 1 444 *5 | |||||||
| Mass | 2250 kg (Only for main body:This differs depending on the option configuration.) | |||||||
| Placement head | 16-nozzle head ( With Dual Heads ) |
12-nozzle head ( With Dual Heads ) |
8-nozzle head ( With Dual Heads ) |
3-nozzle head ( With Dual Heads ) |
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| Placement speed | 70 000cph (0.051 s/ chip) |
62 500cph (0.058 s/ chip) |
40 000cph (0.090 s/ chip) |
11 000 cph (0.33 s/ QFP) |
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| IPC9850 (1608) | 53 800 cph*8 | 48 000 cph*8 | - | - | ||||
| Placement accuracy (Cpk≧1) | ± 40 µm/chip | ±40 µm/chip ± 30µm/QFP 12mm to 32mm ± 50 µm/QFP 12mm Under |
± 30 µm/QFP | |||||
| Component dimensions (mm) | (01005") 0402 chip*6 to L 6 x W 6 x T 3 | (01005") 0402 chip*6 to L 12 x W 12 x T 6.5 | (01005") 0402 chip*6 to L 32 x W 32 x T 12 | (0201'')0603 chip to L 150 × W 25 (diagonal152) × T 28 | ||||
| Component supply | Taping | Tape : 8 / 12 / 16 / 24 / 32 / 44 / 56 mm | Tape : 8 to 56 / 72 mm | Tape : 8 to 56 / 72 / 88 / 104 mm | ||||
| Max.120 ( 8 mm tape : double feeder, (small real) ) | Front/rear feeder cart specifications : Max.120 ( Tape width and feeder are subject to the conditions on the left) Single tray specifications : Max.86 ( Tape width and feeder are subject to the conditions on the left) Twin tray specifications : Max.60 ( Tape width and feeder are subject to the conditions on the left) |
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| Stick | - | Front/rear feeder cart specifications : Max.14 Single tray specifications : Max.10 Twin tray specifications : Max.7 |
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| Tray | - | Single tray specifications : Max.20 Twin tray specifications : Max.40 |
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| Dispensing head | Dot dispensing | Draw dispensing | ||||||
| Dispensing speed | 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) | 3.75 s/component (Condition: 30 mm x 30 mm corner dispensing) | ||||||
| Adhesive position accuracy (Cpk≧1) | ± 75 μ m /dot | ± 100 μ m /component | ||||||
| Applicable components | 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP | SOP,PLCC,QFP, Connector, BGA, CSP | ||||||
| Inspection head | 2D inspection head (A) | 2D inspection head (B) | ||||||
| Resolution | 18 µm | 9 µm | ||||||
| View size (mm) | 44.4 x 37.2 | 21.1 x 17.6 | ||||||
| Inspection processing time | Solder Inspection *10 | 0.35s/ View size | ||||||
| Component Inspection *10 | 0.5s/ View size | |||||||
| Inspection object | Solder Inspection *10 | Chip component : 100 μm × 150 μm or more (0603 / 0201" or more) Package component : φ150 μm or more | Chip component : 80 μm × 120 μm or more (0402 / 01005" or more) Package component : φ120 μm or more | |||||
| Component Inspection *10 | Square chip (0603 / 0201" or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector, Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf | Square chip (0402 / 01005" or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector, Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf | ||||||
| Inspection items | Solder Inspection *10 | Oozing, blur, misalignment, abnormal shape, bridging | ||||||
| Component Inspection *10 | Missing, shift, flipping, polarity, foreign object inspection *9 | |||||||
| Inspection position accuracy*11 ( Cpk≧1) | ± 20 μm | ± 10 μm | ||||||
| No. of inspection | Solder Inspection *10 | Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) | ||||||
| Component Inspection *10 | Max. 10 000 pcs./machine | |||||||
INFO
DOCUMENT DOWNLOAD:
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