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Home SMT MACHINE Pick & Place Machine Panasonic NPM-D3
Panasonic NPM-TT
Panasonic NPM-TT
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Panasonic NPM-W2
Panasonic NPM-W2

Panasonic NPM-D3

Quick-change feeder carts
Mounting Speed: 84,000 cph
placement accuracy: 25um
AM-series intelligent feeders & nozzles
Product description: Panasonic NPM-D3 Pick and Place Machine, Mounting Speed: 84,000 cph, placement accuracy: 25um, Quick-change feeder carts, AM-series intelligent feeders & nozzles

Placement Head

16 nozzle head
12 nozzle head
8 nozzle head
2 nozzle head

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SKU: NM-EJM6D Categories: Pick & Place Machine, SMT MACHINE
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  • Description
  • SPECIFICATION
  • INFO
Description

High productivity per unit area:High productivity per unit area is achieved in the integrated mounting production line, and high efficiency and high quality production can be achieved through the coherent system of mounting and inspection.

Strong flexibility:The “Plug & Play” function can be liberalized through the configuration of each process placement head. Customers can freely choose the actual installation production line and freely set the position of each work head, bringing unlimited flexibility to production.

Easy to operate: It adopts humanized interface design and has an operation guidance system, which is convenient for operators to use.

High-precision placement:It has high mounting accuracy. For example, in high production mode, the mounting accuracy can reach ±40μm/chip, and in high precision mode, the mounting accuracy can reach ±30μm/chip (±25μm/chip).

Wide adaptability of components: Can handle components from 03015mm (metric 0402) microchips to large 100×90mm components up to 28mm, as well as components for packaging applications.

Excellent substrate handling capabilities: Advanced board handling design that can handle 750 mm long substrates in single-track mode; through simple software switching, it can automatically convert to dual-channel “shared” or “independent” mode, and provide automatic board support and feeder car hot swap.

Rich system software: For example, mounting height control system, APC system, component calibration option, automatic model switching option, upper communication option, etc.

Good scalability: It inherits the same platform as Panasonic’s CM series and is compatible with the hardware of the CM series.

Multifunctional production line:The double-track conveyor belt enables mixed production of different types of substrates on the same production line.

SPECIFICATION
Model ID NPM-D3
Rear head
Front head
Lightweight 16-nozzle head 12-nozzle head 8-nozzle head 2-nozzle head Dispensing head No head
Lightweight 16-nozzle head NM-EJM6D NM-EJM6D-MD NM-EJM6D
12-nozzle head
8-nozzle head
2-nozzle head
Dispensing head NM-EJM6D-MD -- NM-EJM6D-D
Inspection head NM-EJM6D-MA NM-EJM6D-A
No head NM-EJM6D NM-EJM6D-D --
PCB dimensions*1 (mm) Dual-lane mode L 50 x W50 ~ L 510 x W 300
Single-lane mode L 50 x W50 ~ L 510 x W 590
PCB exchange time Dual-lane mode 0 s* *No 0s when cycle time is 3.6 s or less
Single-lane mode 3.6 s* *When selecting short conveyors
Electric source 3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA
Pneumatic source *2 0.5 MPa, 100 L /min (A.N.R.)
Dimensions *2 (mm) W 832 x D 2 652 *3 x H 1 444 *4
Mass 1 680 kg (Only for main body:This differs depending on the option configuration.)
Placement head Lightweight 16-nozzle head (Per head) 12-nozzle head (Per head) 8-nozzle head (Per head) 2-nozzle head (Per head)
High production mode [ON] High production mode [OFF]
Max. speed 42 000 cph (0.086 s/ chip) 38 000 cph (0.095 s/ chip) 34 500 cph (0.104 s/ chip) 21 500 cph(0.167 s/ chip) 5 500 cph(0.655 s/ chip)
4 250 cph(0.847 s/ QFP)
Placement accuracy
(Cpk≧1)
± 40 µm/chip ±30 μm / chip
(±25 μm / chip*5)
±30 μm / chip ± 30 µm/chip
± 30 µm/QFP
12mm to 32mm
± 50 µm/QFP
12mm Under
± 30 µm/QFP
Component dimensions (mm) 0402 chip*6 to L 6 x W 6 x T 3 03015*6*7/0402 chip*6 to L 6 x W 6 x T 3 0402 chip*6 to L 12 x W 12 x T 6.5 0402 chip*6 to L 32 x W 32 x T 12 0603 chip to L 100 x W 90 x T 28
Component supply Taping Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 4 to 56 / 72 / 88 / 104 mm
Max. 68 (4, 8 mm tape, Small reel)
Stick - Max.16 (Single stick feeder)
Tray - Max.20 (per tray feeder)
Dispensing head Dot dispensing Draw dispensing
Dispensing speed 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) 4.25 s/component (Condition: 30 mm x 30 mm corner dispensing)*8
Adhesive position accuracy (Cpk≧1) ± 75 μ m /dot ± 100 μ m /component
Applicable components 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP SOP,PLCC,QFP, Connector, BGA, CSP
Inspection head 2D inspection head (A) 2D inspection head (B)
Resolution 18 µm 9 µm
View size (mm) 44.4 x 37.2 21.1 x 17.6
Inspection
processing
time
Solder
Inspection *9
0.35s/ View size
Component
Inspection *9
0.5s/ View size
Inspection object Solder
Inspection *9
Chip component : 100 μm x 150 μm or more (0603 mm or more)
Package component : φ150 μm or more
Chip component : 80 μm x 120 μm or more (0402 mm or more)
Package component : φ120 μm or more
Component
Inspection *9
Square chip (0603 mm or more), SOP, QFP (a pitch of 0.4 mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 Square chip (0402 mm or more), SOP, QFP (a pitch of 0.3 mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10
Inspection items Solder
Inspection *9
Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *9
Missing, shift, flipping, polarity, foreign object inspection *11
Inspection position accuracy *12 ( Cpk≧1) ± 20 μm ± 10 μm
No. of
inspection
Solder
Inspection *9
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *9
Max. 10 000 pcs./machine
INFO

DOCUMENT DOWNLOAD:

NPM-D3 PDF

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