| Model ID |
NPM-W2 |
| Rear head |
Lightweight |
12-nozzle head |
Lightweight |
3-nozzle head V2 |
Dispensing head |
No head |
| Front head |
16-nozzle head |
8-nozzle head |
| Lightweight 16-nozzle head |
NM-EJM7D |
NM-EJM7D-MD |
NM-EJM7D |
| 12-nozzle head |
| Lightweight 8-nozzle head |
| 3-nozzle head V2 |
| Dispensing head |
NM-EJM7D-MD |
- |
NM-EJM7D-D |
| Inspection head |
NM-EJM7D-MA |
NM-EJM7D-A |
| No head |
NM-EJM7D |
NM-EJM7D-D |
- |
| PCB dimensions (mm) |
Single-lane*1 |
Batch mounting |
L 50 x W 50 ~ L 750 x W 550 |
| 2-positin mounting |
L 50 x W 50 ~ L 350 x W 550 |
| Dual-lane*1 |
Dual transfer (Batch) |
L 50 × W 50 ~ L 750 × W 260 |
| Dual transfer (2-positin) |
L 50 × W 50 ~ L 350 × W 260 |
| Single transfer (Batch) |
L 50 × W 50 ~ L 750 × W 510 |
| Single transfer (2-positin) |
L 50 × W 50 ~ L 350 × W 510 |
| Electric source |
3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA |
| Pneumatic source *2 |
0.5 MPa, 200 L /min (A.N.R.) |
| Dimensions *2 (mm) |
W 1 280*3 × D 2 332 *4 × H 1 444 *5 |
| Mass |
2 470 kg (Only for main body : This differs depending on the option configuration.) |
| Placement head |
Lightweight 16-nozzle head
(Per head) |
12-nozzle head
(Per head) |
Lightweight 8-nozzle head
(Per head) |
3-nozzle head V2
(Per head) |
|
High production mode
[ON] |
High production mode
[OFF] |
High production mode [ON] |
High production mode [OFF] |
| Max. speed |
38 500cph
(0.094 s/ chip) |
35 000cph
(0.103 s/ chip) |
32 250cph
(0.112 s/ chip) |
31 250cph
(0.115 s/ chip) |
20 800cph
(0.173 s/ chip) |
8 320cph
(0.433 s/ chip)
6 500cph
(0.554 s/ QFP) |
Placement accuracy
(Cpk≧1) |
±40 μm / chip |
±30 μm / chip
(±25μm / chip)*6 |
±40 μm / chip |
±30 μm / chip |
± 30 µm/chip
± 30 µm/QFP12mm
to32mm
± 50 µm/QFP12mm Under |
± 30 µm/QFP |
Component
dimensions
(mm) |
0402*7 chip ~ L 6 x W 6 x T 3 |
03015*7 *8/0402*7 chip ~ L 6 x W 6 x T 3 |
0402*7 chip ~ L 12 x W 12 x T 6.5 |
|
0402*7 chip ~ L 32 x W 32 x T 12 |
0603 chip to L 150 x W 25 (diagonal152) x T 30 |
| Component supply |
Taping |
Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm |
Tape : 4 to 56 mm |
Tape : 4 to 56 / 72 / 88 / 104 mm |
| Max.120 (Tape: 4, 8 mm) |
Front/rear feeder cart specifications : Max.120
( Tape width and feeder are subject to the conditions on the left)
Single tray specifications : Max.86
( Tape width and feeder are subject to the conditions on the left)
Twin tray specifications : Max.60
( Tape width and feeder are subject to the conditions on the left) |
| Stick |
|
|
|
Front/rear feeder cart specifications :
Max.30 (Single stick feeder)
Single tray specifications :
Max.21 (Single stick feeder)
Twin tray specifications :
Max.15 (Single stick feeder) |
| Tray |
|
|
|
Single tray specifications : Max.20
Twin tray specifications : Max.40 |
| Dispensing head |
Dot dispensing |
Draw dispensing |
| Dispensing speed |
0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) |
4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9 |
| Adhesive position accuracy (Cpk≧1) |
± 75 μ m /dot |
± 100 μ m /component |
| Applicable components |
1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP |
BGA, CSP |
| Inspection head |
|
2D inspection head (A) |
2D inspection head (B) |
| Resolution |
|
18 µm |
9 µm |
| View size (mm) |
|
44.4 x 37.2 |
21.1 x 17.6 |
Inspection
processing
time |
Solder
Inspection *1 |
0.35s/ View size |
Component
Inspection *10 |
0.5s/ View size |
| Inspection object |
Solder
Inspection *1 |
Chip component : 100 μm × 150 μm or more (0603 or more)
Package component : φ150 μm or more |
Chip component : 80 μm × 120 μm or more (0402 or more)
Package component : φ120 μm or more |
Component
Inspection *10 |
Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 |
Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*11 |
Inspection
items |
Solder
Inspection *1 |
Oozing, blur, misalignment, abnormal shape, bridging |
Component
Inspection *10 |
Missing, shift, flipping, polarity, foreign object inspection *12 |
| Inspection position accuracy *13 (Cpk≧1) |
± 20 μm |
± 10 μm |
No. of
inspection |
Solder
Inspection *1 |
Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) |
Component
Inspection *10 |
Max. 10 000 pcs./machine |
|
