I. Preparation stage management measures:
Ensure that all relevant personnel understand the product process requirements.
Develop PCB, stencil and solder paste selection specifications and inspection standards.
For low-temperature applications, choose appropriate materials such as Sn43/Pb43/Bi14; for high-temperature and lead-free applications, choose Sn96/Ag4, Sn95/Sb5 and so on.
Once PCBs are found to be wet or contaminated, cleaning and baking standards need to be strictly followed.
Establish specific standards for PCB positioning and stencil mounting.
Define the duties and requirements of the press equipment engineer.
Define the functions and standards of the Solder Paste Addition Operator.
Write documentation for SMT solder paste printing process parameters.
Develop documentation for solder paste dosing process.
Develop relevant inspection standards.
II.The supervision of the printing process:
The operation of the printing machine and parameter settings should be strictly based on the process documents, and designate the responsible person.
The person responsible for adding solder paste shall be trained.
Perform first piece print test and its inspection.
Establish process inspection procedures to ensure that each PCB meets inspection specifications after printing with reference documents to assist operations.
Perform and document routine maintenance of the printing machine.
All operation activities need to be recorded.
At the completion of production of each product or at the end of the working day, it is necessary to reset the printing parameters and clean the templates, squeegees, and other equipment completely and appropriately according to the requirements.